ADI晶圓化合物半導體材料
發布時間:2021-03-18 17:13:47 瀏覽:3664
ADI晶圓的制取包括襯底制取和外延性工藝。襯底是由半導體材料單晶材料制作而成的晶片。該基板可直接進入晶圓制造流程以生產制造半導體元器件或外延性晶圓。外延性是指在單晶襯底上生長一層新單晶的流程。ADI新的單晶能夠是與襯底相同的材料,還可以是有所不同的材料。外延性能夠產生越來越多種類的材料,使元器件設計有越來越多的選擇。
襯底制取的基礎步驟如下:首先,對半導體材料多晶材料進行提煉、摻雜和拉伸,獲得單晶材料。以硅為例子,先將硅砂精煉、復原為純度98%左右的冶金工業級粗硅,再通過多次提煉,獲得電子級高純度多晶硅,再經爐拉獲得單晶硅棒。通過機械加工、化學處理、表面拋光和質量檢測,獲得了滿足一定標準的單晶拋光片。拋光的目的是更進一步去除加工表面上的殘余損傷層。綜上所述拋光片可直接適用于制造元器件,也可用作外延性的襯底材料。
深圳市立維創展科技有限公司,優勢渠道提供ADI晶圓產品華夫格,專業通道,歡迎合作。
詳情了解ADI Wafer產品請點擊: http : //www.365jkr.com/public/brand/68.html
或聯系我們的銷售工程師: 0755- 83642657 QQ : 2295048674

Generic | Material | Description | Order Qty | Package Option | Category |
ADA4841-2 | ADA4841-2KGD-WP | Dual Low Power Low Noise Rail-Rail OpAmp | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-WP | Single Channel High Speed, 1A Output | Contact ADI | WAFFLEPACK | Amplifiers |
ADA4870 | ADA4870-KGD-DF | Single Channel High Speed, 1A Output | Contact ADI | FILMFRAME | Amplifiers |
ADN2820 | ADN2820ACHIPS | 10Gbps Tranimpedance Amplifier | Contact ADI | WAFFLEPACK | Amplifiers |
ADN2880 | ADN2880ACHIPS | 2.7Gbps Transimpedance Amplifier IC. | Contact ADI | WAFFLEPACK | Amplifiers |
OP27 | OP27NBC | 9/30V, BIP, OP, Low Noise, Low Dr | Contact ADI | WAFFLEPACK | Amplifiers |
OP284 | OP284CHIPS | 3/30V, BIP, OP, Low Noise, RRIO, 2X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37NBC | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP37 | OP37-001C | 9/30V, BIP, OP, Low Noise, Avo >-5, 1X | Contact ADI | FILMFRAME | Amplifiers |
OP400 | OP400GBC | 6/30V, BIP, OP, Low Vos, Low Isy, 4X | Contact ADI | WAFFLEPACK | Amplifiers |
OP42 | OP42NBC | Fast Settling Precision op amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP467 | OP467GBC | Quad Precision, High Speed Op Amp | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77NBC | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | WAFFLEPACK | Amplifiers |
OP77 | OP77-001C | 6/30V, BIP, OP, Low Vos, Precision, 1X | Contact ADI | FILMFRAME | Amplifiers |
HMC-ALH102G | HMC-ALH102 | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH102G | HMC-ALH102-SX | GaAs HEMT WBand lo Noise amp, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482 | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-ALH482G | HMC-ALH482-SX | GaAs HEMT WBand lo Noise amp, 2 - 22 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH232G | HMC-AUH232 | GaAs HEMT WBand Driver amp, DC - 43 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH249G | HMC-AUH249 | GaAs HEMT WBand Driver amp, DC - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC-AUH312G | HMC-AUH312 | GaAs HEMT WBand Driver amp, DC - 65 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460 | WBand lo Noise amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC460G | HMC460-SX | amp, lo Noise, DC-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462 | low Noise amp Chip, 2 - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC462G | HMC462-SX | I.C., 2-20 GHz WBand LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463 | low Noise amp Chip w/AGC, 2-20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC463G | HMC463-SX | I.C., 2-20GHz LNA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465 | WBand Driver amp Chip, DC - 20 GHz | Contact ADI | GEL_PACK | Amplifiers |
HMC465G | HMC465-SX | I.C., DC-20GHz PA Die | Contact ADI | GEL_PACK | Amplifiers |
HMC562G | HMC562 | WBand Driver amp Chip, 2 - 35 GHz | Contact ADI | GEL_PACK | Amplifiers |
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